Shanghai Huitian New Material Co., Ltd
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5280 1:1 Gray Silicone Potting Compound for Electronics with High Thermal Conductivity

5280 1:1 Gray Silicone Potting Compound for Electronics with High Thermal Conductivity

5280 1:1 Gray Silicone Potting Compound for Electronics with High Thermal Conductivity

পণ্যের বিবরণ:
উৎপত্তি স্থল: চীন
পরিচিতিমুলক নাম: HUITIAN
সাক্ষ্যদান: RoHS REACH
মডেল নম্বার: 5280
বিস্তারিত তথ্য
উৎপত্তি স্থল:
চীন
পরিচিতিমুলক নাম:
HUITIAN
সাক্ষ্যদান:
RoHS REACH
মডেল নম্বার:
5280
শারীরিক গঠন:
আটকান
রঙের অংশ A:
ধূসর তরল
রং খ:
সাদা তরল
সান্দ্রতা অংশ A:
2,000 ~ 3,500 এমপিএ · এস
সান্দ্রতা অংশ বি:
2,000 ~ 3,500 এমপিএ · এস
মিশ্রণ অনুপাত:
1: 1
কাজ করার সময় @25 °C:
60-240 মিনিট
কুরিং টাইম @80°C:
≤30 মিনিট
কঠোরতা:
10 ~ 30 তীরে ক
ভলিউম প্রতিরোধ ক্ষমতা:
1.0*10^12 Ω∙ সেমি
ডাইলেট্রিক শক্তি:
≥14 কেভি/মিমি
তাপ পরিবাহিতা:
≥0.6 ডাব্লু/(এম • কে)
বিশেষভাবে তুলে ধরা:
gray silicone potting compound , high thermal conductivity potting compound , electronics silicone potting compound
ট্রেডিং তথ্য
ন্যূনতম চাহিদার পরিমাণ:
200 কেজি
মূল্য:
আলোচনাযোগ্য
প্যাকেজিং বিবরণ:
20 কেজি/ব্যারেল
ডেলিভারি সময়:
5-8 দিন
পরিশোধের শর্ত:
এল/সি, টি/টি
যোগানের ক্ষমতা:
2000T/মাস
পণ্যের বর্ণনা
5280 Two-Part 1:1 Gray Silicone Potting Compound For Electronics
High-performance potting compound designed for module power supply, LED drive power supply, network transformer, reversing radar, and other electronic applications. Provides moistureproof, anti-corrosion, and shock-proof protection.
Product Attributes
Attribute Value
Physical Form Paste
Color Part A Gray fluid
Color Part B White fluid
Viscosity Part A 2,000~3,500 mPa·s
Viscosity Part B 2,000~3,500 mPa·s
Mixing Ratio 1:1
Operating Time @25 °C 60-240 mins
Curing Time @80℃ ≤30 mins
Hardness 10~30 Shore A
Volume resistivity 1.0*10^12 Ω∙cm
Dielectric strength ≥14 KV/mm
Thermal Conductivity ≥0.6 W/(m•K)
Product Description
5280 Potting Compound is a high-performance, two-part addition-type silicone rubber designed specifically for the electronics industry. This gray, high thermal conductive compound offers exceptional insulation properties, flame retardancy, and mechanical stability over a wide temperature range. It is ideal for protecting sensitive electronic components from environmental hazards while ensuring long-term reliability and performance.
Download Technical Data Sheet (PDF)
Product Applications
  • Module Power Supplies: Provides moistureproofing and insulation to protect against short circuits and corrosion.
  • LED Drive Power Supplies: Ensures thermal management and mechanical stability, prolonging the lifespan of LED components.
  • Network Transformers: Offers excellent insulation and anti-fouling properties to maintain signal integrity.
  • Reversing Radars: Protects sensitive radar components from moisture and physical shock, ensuring reliable operation.
  • General Electronics: Suitable for a wide range of electronic components, providing comprehensive protection against moisture, dust, corrosion, and mechanical shock.
Key Product Features
  • High Thermal Conductivity: With a thermal conductivity of ≥0.6 W/m*K, the compound efficiently dissipates heat, ensuring optimal performance of electronic components.
  • UL94V-0 Flame Retardant: Meets stringent safety standards, providing excellent fire resistance and reducing the risk of electrical fires.
  • Excellent Insulation: Features a dielectric strength of ≥14 KV/mm, ensuring reliable electrical insulation and preventing short circuits.
  • Wide Temperature Range: Maintains rubber elasticity from -50°C to 200°C, ensuring consistent performance in extreme conditions.
  • RoHS Compliant: Environmentally friendly and compliant with the Restriction of Hazardous Substances Directive.
  • Ease of Use: 1:1 mix ratio simplifies the application process, ensuring consistent performance and reducing the risk of errors.
Technical Parameters
Physical Properties Before Curing (25 ±2℃, 60%±5%RH)
Appearance (A) Gray flow
Appearance (B) White flow
Viscosity (A) 2,000~3,500 mPa*s
Viscosity (B) 2,000~3,500 mPa*s
Curing Properties (A:B=1:1)
Operating Time (25℃) 60~240 min
Curing Time (85℃) ≤30 min
Physical Properties After Curing (25 ±2℃, 60±5%RH, A:B=1:1)
Density 1.70~1.9 g/cm³
Hardness 10~30 Shore A
Shear Strength (PCB) 0.3-0.8 MPa
Thermal Conductivity ≥0.6 W/m*K
Dielectric Strength ≥14 KV/mm
Volume Resistivity ≥1.0*10¹² Ω*cm
Directions for Use
Preparation
  • Stirring: Fully stir part A and part B separately, either manually or mechanically, to ensure homogeneity and avoid performance changes due to filler settlement.
Mixing
  • Weighing: Accurately weigh the two parts into a clean container by weight ratio (1:1) and stir well to ensure thorough mixing.
Defoaming
  • Natural Defoaming: Allow 20-30 minutes for natural defoaming after filling the mixed glue into the components.
  • Vacuum Defoaming: For faster defoaming, pot the components after pumping for 5-10 minutes at a vacuum degree of 0.08-0.1 MPa.
Potting
  • Surface Preparation: Ensure the surfaces to be potted are clean and dry. Apply the glue while it still has good flowability to achieve optimal leveling.
Curing
  • Curing Conditions: The glue can cure at room temperature or by heating. Higher temperatures accelerate curing, and heat curing is recommended in colder conditions (e.g., winter).
Packaging & Storage Conditions
Packaging
  • 5280CA9 (20 kg/barrel), 5280CB9 (20 kg/barrel)
Storage
Store at room temperature in a cool and dry place. The shelf life is 6 months.
5280 1:1 Gray Silicone Potting Compound for Electronics with High Thermal Conductivity 0 5280 1:1 Gray Silicone Potting Compound for Electronics with High Thermal Conductivity 1 5280 1:1 Gray Silicone Potting Compound for Electronics with High Thermal Conductivity 2

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